发明申请
- 专利标题： Electronic component and a system and method for producing an electronic component
- 专利标题（中）： 电子部件以及电子部件的制造方法
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申请号： US11454996申请日： 2006-06-16
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公开(公告)号： US20070010077A1公开(公告)日： 2007-01-11
- 发明人: Philipp Riess , Henning Feick , Martin Wendel
- 申请人： Philipp Riess , Henning Feick , Martin Wendel
- 优先权： DE102005028919.3-33 20050622
- 主分类号： H01L21/22
- IPC分类号： H01L21/22
摘要：
In a method for producing an electronic component, a substrate is doped by introducing doping atoms. In the doped substrate, at least one connection region of the electronic component is formed by doping with doping atoms. Furthermore, at least one additional doped region is formed at least below the at least one connection region by doping with doping atoms. Furthermore, at least one well region is formed in the substrate by doping with doping atoms in such a way that the well region doping is blocked at least below the at least one additional doped region.
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