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发明申请
US20070015313A1 Submount of semiconductor laser diode, method of manufacturing the same, and semiconductor laser diode assembly using the submount 审中-公开
半导体激光二极管的基座，其制造方法以及使用该基座的半导体激光二极管组件

Submount of semiconductor laser diode, method of manufacturing the same, and semiconductor laser diode assembly using the submount
摘要：
Provided is a submount flip-chip bonded to a semiconductor laser diode chip with stepped first and second electrodes. The submount includes a substrate having first and second surfaces which are separated by a step height corresponding to a height difference between the first and second electrodes; first and second metal layers being formed to the same thickness on the first and second surfaces, respectively; and first and second solder layers being formed to the same thickness on the first and second metal layers, respectively, and being bonded to the first and second electrodes, respectively.
摘要（中）：

提供了一种与具有阶梯状的第一和第二电极的半导体激光二极管芯片接合的底座倒装芯片。 所述基座包括具有第一和第二表面的基板，所述第一和第二表面被分隔开与所述第一和第二电极之间的高度差相对应的台阶高度; 分别在第一和第二表面上形成相同厚度的第一和第二金属层; 并且第一和第二焊料层分别在第一和第二金属层上形成为相同的厚度，并分别结合到第一和第二电极。

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