发明申请
- 专利标题： Electrically connecting substrate with electrical device
- 专利标题（中）： 电气连接基板与电气设备
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申请号： US11181479申请日： 2005-07-14
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公开(公告)号： US20070015353A1公开(公告)日： 2007-01-18
- 发明人: David Craig , Chien-Hua Chen
- 申请人： David Craig , Chien-Hua Chen
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.
公开/授权文献
- US07476608B2 Electrically connecting substrate with electrical device 公开/授权日：2009-01-13
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