发明申请
- 专利标题: Method for Manufacturing Multi-Layered Ceramic Electronic Component
- 专利标题(中): 多层陶瓷电子元件制造方法
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申请号: US10550713申请日: 2004-03-31
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公开(公告)号: US20070017091A1公开(公告)日: 2007-01-25
- 发明人: Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
- 申请人: Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
- 申请人地址: JP TOKYO 103-8272
- 专利权人: TDK CORPORATION
- 当前专利权人: TDK CORPORATION
- 当前专利权人地址: JP TOKYO 103-8272
- 优先权: JP2003-096090 20030331
- 国际申请: PCT/JP04/04729 WO 20040331
- 主分类号: H05K3/36
- IPC分类号: H05K3/36
摘要:
It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of positioning a multi-layered unit including a release layer, an electrode layer and a ceramic green sheet formed on a support sheet in such a manner that the surface of the multi-layered unit is located on a base substrate and a step of pressing the multi-layered unit toward the base substrate, thereby laminating the multi-layered unit on the base substrate, and employs as the base substrate a base substrate having such surface roughness as to include per 0.01 mm2 thereof not more than one protrusion that can penetrate the ceramic green sheet of the multi-layered unit laminated on the base substrate to half or more the thickness of the ceramic green sheet and include per 100 mm2 thereof not more than one protrusion that can completely penetrate the ceramic green sheet.