发明申请
- 专利标题: INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS
- 专利标题(中): 电子元件集成液体冷却系统
-
申请号: US11308275申请日: 2006-03-15
-
公开(公告)号: US20070023167A1公开(公告)日: 2007-02-01
- 发明人: Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
- 申请人: Tay-Jian Liu , Chih-Hao Yang , Chao-Nien Tung , Chuen-Shu Hou
- 优先权: TW094125772 20050729
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
An integrated liquid cooling system (100) includes a pump (10), a mounting base (15), a heat dissipating member (20). The mounting base defines therein a through hole (151). The heat dissipating member is mounted to and maintained in fluid communication with the mounting base. The pump is received in the through hole of the mounting base. The pump has a bottom plate for thermally contacting a heat generating component and is configured for driving a coolant to circulate through the mounting base and the heat dissipating member. The pump, the mounting base and the heat dissipating member of the liquid cooling system are combined together to form an integrated and compact structure without utilizing any connecting pipes or fittings.
公开/授权文献
- US07360583B2 Integrated liquid cooling system for electronic components 公开/授权日:2008-04-22
信息查询