发明申请
US20070023167A1 INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS 失效
电子元件集成液体冷却系统

INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS
摘要:
An integrated liquid cooling system (100) includes a pump (10), a mounting base (15), a heat dissipating member (20). The mounting base defines therein a through hole (151). The heat dissipating member is mounted to and maintained in fluid communication with the mounting base. The pump is received in the through hole of the mounting base. The pump has a bottom plate for thermally contacting a heat generating component and is configured for driving a coolant to circulate through the mounting base and the heat dissipating member. The pump, the mounting base and the heat dissipating member of the liquid cooling system are combined together to form an integrated and compact structure without utilizing any connecting pipes or fittings.
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