Invention Application
- Patent Title: Semiconductor Wafer with a Wiring Structure, a Semiconductor Component, and Methods for Their Production
- Patent Title (中): 具有接线结构的半导体晶片，半导体元件及其制造方法
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Application No.: US11427204Application Date: 2006-06-28
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Publication No.: US20070023881A1Publication Date: 2007-02-01
- Inventor: Helmut Strack
- Applicant: Helmut Strack
- Priority: DE102005030466.4 20050628
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L21/00
Abstract:
A semiconductor wafer is provided with a wiring structure, and semiconductor chip positions arranged in rows and columns. The semiconductor wafer has at least one coating (6) as a self-supporting dimensionally stable substrate layer (4), and/or as a wiring structure composed of conductive, high-temperature-resistant material. The coating material (6) of the substrate layer (4) and/or of the wiring structure has a ternary carbide and/or a ternary nitride and/or carbon.
Public/Granted literature
- US07344936B2 Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production Public/Granted day:2008-03-18
Information query
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