发明申请
- 专利标题： Semiconductor Wafer with a Wiring Structure, a Semiconductor Component, and Methods for Their Production
- 专利标题（中）： 具有接线结构的半导体晶片，半导体元件及其制造方法
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申请号： US11427204申请日： 2006-06-28
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公开(公告)号： US20070023881A1公开(公告)日： 2007-02-01
- 发明人: Helmut Strack
- 申请人： Helmut Strack
- 优先权： DE102005030466.4 20050628
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L21/00
摘要：
A semiconductor wafer is provided with a wiring structure, and semiconductor chip positions arranged in rows and columns. The semiconductor wafer has at least one coating (6) as a self-supporting dimensionally stable substrate layer (4), and/or as a wiring structure composed of conductive, high-temperature-resistant material. The coating material (6) of the substrate layer (4) and/or of the wiring structure has a ternary carbide and/or a ternary nitride and/or carbon.
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