发明申请
- 专利标题： METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER
- 专利标题（中）： 通过钝化层暴露的金属垫或金属保护层
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申请号： US11461416申请日： 2006-07-31
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公开(公告)号： US20070026631A1公开(公告)日： 2007-02-01
- 发明人: Mou-Shiung Lin , Hsin-Jung Lo , Chiu-Ming Chou , Chien-Kang Chou , Ke-Hung Chen
- 申请人： Mou-Shiung Lin , Hsin-Jung Lo , Chiu-Ming Chou , Chien-Kang Chou , Ke-Hung Chen
- 主分类号： H01L21/76
- IPC分类号： H01L21/76
摘要：
A circuitry component comprising a semiconductor substrate, a pad over said semiconductor substrate, a tantalum-containing layer on a side wall and a bottom surface of said pad, a passivation layer over said semiconductor substrate, an opening in said passivation layer exposing said pad, a titanium-containing layer over said pad exposed by said opening, and a gold layer over said titanium-containing layer.
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