Invention Application
US20070029700A1 Film forming mold, film forming method using mold, and film forming control system
有权
成膜模具,使用模具的成膜方法和成膜控制系统
- Patent Title: Film forming mold, film forming method using mold, and film forming control system
- Patent Title (中): 成膜模具,使用模具的成膜方法和成膜控制系统
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Application No.: US10557784Application Date: 2004-05-17
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Publication No.: US20070029700A1Publication Date: 2007-02-08
- Inventor: Motosuke Ishizawa , Takao Umezawa
- Applicant: Motosuke Ishizawa , Takao Umezawa
- Applicant Address: JP Ota-Shi, Gunma 373-0847
- Assignee: OSHIMA ELECTRIC WORKS CO., LTD.
- Current Assignee: OSHIMA ELECTRIC WORKS CO., LTD.
- Current Assignee Address: JP Ota-Shi, Gunma 373-0847
- Priority: JP2003-140060 20030519
- International Application: PCT/JP04/06981 WO 20040517
- Main IPC: B28B7/22
- IPC: B28B7/22 ; B29C51/20

Abstract:
When forming a film on work, such as a lamp holder, the work is not set in a film-forming chamber as in the prior arts, but a film is formed thereon by using a mold, thereby simplifying the film formation work. A movable mold is matched to a fixed mold in a state where a vacuum deposition apparatus, the film-forming element, is provided in the fixed mold and the work is supported in the movable mold. Next, film formation is carried out with the film-forming space in a vacuum state. Thereafter, the movable mold is opened, wherein the film formation work on the work surface using molds can be carried out with a series of processes.
Public/Granted literature
- US07740783B2 Film forming mold, film forming method using mold, and film forming control system Public/Granted day:2010-06-22
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