发明申请
- 专利标题： Method for forming conductive wiring and interconnects
- 专利标题（中）： 形成导电布线和互连的方法
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申请号： US11197822申请日： 2005-08-05
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公开(公告)号： US20070032060A1公开(公告)日： 2007-02-08
- 发明人: Ta-Hung Yang
- 申请人： Ta-Hung Yang
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method for forming conductive wiring is provided. First, a material layer having at least a trench is provided. A conductive material layer is formed on the material layer to fill the trench and cover the top surface of the material layer. A patterned mask layer is formed on the conductive material layer. The conductive material layer not covered by the patterned mask layer is removed. After that, the patterned mask layer is removed.
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