发明申请
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US11500427申请日： 2006-08-08
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公开(公告)号： US20070035016A1公开(公告)日： 2007-02-15
- 发明人: Takayuki Yamaji , Hiroshi Ishikawa , Takashi Katsuki , Yuji Takahashi , Fumihiko Nakazawa , Satoshi Sano
- 申请人： Takayuki Yamaji , Hiroshi Ishikawa , Takashi Katsuki , Yuji Takahashi , Fumihiko Nakazawa , Satoshi Sano
- 专利权人： FUJITSU MEDIA DEVICES LIMITED,FUJITSU LIMITED
- 当前专利权人： FUJITSU MEDIA DEVICES LIMITED,FUJITSU LIMITED
- 优先权： JP2005-231363 20050809
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor device includes a chip having a base semiconductor layer, an insulation layer provided on the base semiconductor layer, and an upper semiconductor layer provided on the insulation layer; a mounting substrate on which the chip is mounted at the base semiconductor layer; and a connecting portion that electrically couples first terminals provided on the mounting substrate and a surface or second terminals provided thereon of the base semiconductor layer.
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