发明申请
- 专利标题： Semiconductor component comprising an interposer substrate and method for the production thereof
- 专利标题（中）： 包括内插基片的半导体部件及其制造方法
-
申请号： US11466279申请日： 2006-08-22
-
公开(公告)号： US20070040261A1公开(公告)日： 2007-02-22
- 发明人: Wolfgang Hetzel , Jochen Thomas , Peter Weitz , Ingo Wennemuth
- 申请人： Wolfgang Hetzel , Jochen Thomas , Peter Weitz , Ingo Wennemuth
- 优先权： DE102004009056.4 20040223
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A semiconductor component (10) has an interposer substrate (1) as stack element of a semiconductor component stack (25). The interposer substrate (1) has, on one of the interposer substrate sides (2, 4), a semiconductor chip protected by plastics composition (12) in its side edges (22). An interposer structure (3) partly covered by a plastics composition (12) is arranged on the interposer side (2, 4) opposite to the semiconductor chip (6). Edge regions (11) of the interposer substrate (1) remain free of any plastics composition (12) and have, on both interposer sides (2, 4) external contact pads (7) which are electrically connected to one another via through contacts (8).
公开/授权文献
- US08624372B2 Semiconductor component comprising an interposer substrate 公开/授权日：2014-01-07