A method for manufacturing or creating highly integrated satellite systems intended for use within or to construct one or more satellite variants. The integrated satellite systems comprise embedded or encapsulated components, circuitry, and/or networks. Although other methodologies may be employed, an ultrasonic consolidation process is adapted to fabricate integrated satellite systems having a material matrix wherein one or more satellite components and/or material trace elements may be encapsulated. A direct write process may be used simultaneously or in succession with the ultrasonic consolidation process to deposit material traces onto one or more surfaces of the satellite components, thereby providing functional mesoscopic devices or systems.