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    Method for creating highly integrated satellite systems
    1.
    发明申请
    Method for creating highly integrated satellite systems 审中-公开
    创建高度集成的卫星系统的方法

    公开(公告)号：US20070040702A1

    公开(公告)日：2007-02-22

    申请号：US11417004

    申请日：2006-05-02

    申请人： Todd Mosher ,  Brent Stucker

    发明人： Todd Mosher ,  Brent Stucker

    IPC分类号： G08G1/04

    CPC分类号： B64G1/10 ,  B29C64/135

    摘要： A method for manufacturing or creating highly integrated satellite systems intended for use within or to construct one or more satellite variants. The integrated satellite systems comprise embedded or encapsulated components, circuitry, and/or networks. Although other methodologies may be employed, an ultrasonic consolidation process is adapted to fabricate integrated satellite systems having a material matrix wherein one or more satellite components and/or material trace elements may be encapsulated. A direct write process may be used simultaneously or in succession with the ultrasonic consolidation process to deposit material traces onto one or more surfaces of the satellite components, thereby providing functional mesoscopic devices or systems.

    摘要翻译： 一种用于制造或创建旨在用于或构造一个或多个卫星变体的高度集成的卫星系统的方法。 综合卫星系统包括嵌入或封装的组件，电路和/或网络。 尽管可以采用其他方法，但是超声波固结处理适于制造具有材料矩阵的集成卫星系统，其中可以封装一个或多个卫星部件和/或材料微量元件。 直接写入过程可以与超声波固结过程同时或连续地使用以将材料迹线沉积到卫星部件的一个或多个表面上，从而提供功能性的介观器件或系统。

    Surface roughness reduction for improving bonding in ultrasonic consolidation rapid manufacturing
    4.
    发明申请
    Surface roughness reduction for improving bonding in ultrasonic consolidation rapid manufacturing 审中-公开
    用于改善超声波固结快速制造中的粘合的表面粗糙度降低

    公开(公告)号：US20070295440A1

    公开(公告)日：2007-12-27

    申请号：US11807356

    申请日：2007-05-24

    申请人： Brent Stucker ,  Durga Gabbita

    发明人： Brent Stucker ,  Durga Gabbita

    IPC分类号： B32B37/00

    CPC分类号： B23K20/10 ,  B23K20/24 ,  B33Y80/00

    摘要： A method for enhancing the bonding and linear weld density along the interface of material layers deposited in accordance with an ultrasonic consolidation manufacturing process, the method comprising: initiating an ultrasonic consolidation manufacturing process; depositing a first material layer having a contact surface; reducing surface roughness of the contact surface to prepare the contact surface to receive a subsequent material layer, the step of reducing facilitating an increased percentage and quality of material contact between the first and subsequent material layers; and bonding a subsequent material layer to the contact surface of the first material layer, as prepared.

    摘要翻译： 一种用于增强沿着根据超声波固结制造工艺沉积的材料层的界面的键合和线性焊接密度的方法，所述方法包括：引发超声波固结制造工艺; 沉积具有接触表面的第一材料层; 减小接触表面的表面粗糙度以制备接触表面以接收随后的材料层，减少的步骤促进了第一和后续材料层之间的材料接触的增加的百分比和质量; 并且将随后的材料层粘合到所述第一材料层的接触表面上，如所制备的。