发明申请
- 专利标题: Multi-structured Si-fin and method of manufacture
- 专利标题(中): 多结构Si-fin及其制造方法
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申请号: US11589718申请日: 2006-10-31
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公开(公告)号: US20070048947A1公开(公告)日: 2007-03-01
- 发明人: Deok Lee , Byeong Lee , In Jung , Yong Son , Siyoung Choi , Taek Kim
- 申请人: Deok Lee , Byeong Lee , In Jung , Yong Son , Siyoung Choi , Taek Kim
- 优先权: KR2003-56636 20030814
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L21/302 ; H01L21/8238 ; H01L21/8234
摘要:
Disclosed is a semiconductor fin construction useful in FinFET devices that incorporates an upper region and a lower region with wherein the upper region is formed with substantially vertical sidewalls and the lower region is formed with inclined sidewalls to produce a wider base portion. The disclosed semiconductor fin construction will also typically include a horizontal step region at the interface between the upper region and the lower region. Also disclosed are a series of methods of manufacturing semiconductor devices incorporating semiconductor fins having this dual construction and incorporating various combinations of insulating materials such as silicon dioxide and/or silicon nitride for forming shallow trench isolation (STI) structures between adjacent semiconductor fins.
公开/授权文献
- US07534686B2 Multi-structured Si-fin and method of manufacture 公开/授权日:2009-05-19
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