Invention Application
- Patent Title: Process for manufacturing packaged cored welding electrode
- Patent Title (中): 封装焊接电极的制造工艺
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Application No.: US11220165Application Date: 2005-09-06
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Publication No.: US20070051716A1Publication Date: 2007-03-08
- Inventor: Dennis Hartman , Herbert Matthews , James Nicklas , Vaidyanath Rajan
- Applicant: Dennis Hartman , Herbert Matthews , James Nicklas , Vaidyanath Rajan
- Assignee: Lincoln Global, Inc.
- Current Assignee: Lincoln Global, Inc.
- Main IPC: B23K35/02
- IPC: B23K35/02

Abstract:
A manufacturing process is disclosed for manufacturing and packaging cored welding electrode. The process comprises providing core fill material, providing a strip of sheath material, bending the strip into a U or V shape, adding the fill material into a channel of the bent strip, joining the outer edges of the strip to provide a cored electrode with the fill material enclosed within the sheath material, providing a generally rectangular container, and installing the cored electrode into the container.
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