With substrates to be bonded together becoming larger, there are problems in that a bonding apparatus needs to be built larger to maintain accuracy of products and operation of such a bonding apparatus becomes more complicated. A bonding apparatus includes Z-axis drive mechanisms, an upper chamber, and a lower chamber. The Z-axis drive mechanisms for moving an upper frame vertically are disposed at four corners of a mount. The upper chamber is suspended from the upper frame and has an upper table inside. The lower chamber has a lower table inside. The lower table is supported on the mount via a plurality of support legs. The upper chamber and the lower chamber are united together through a seal ring to define a vacuum chamber. The upper table is coupled to the upper frame and moved by the Z-axis drive mechanisms via the upper frame. Moving the upper frame moves the upper chamber vertically to open or close the vacuum chamber. The lower table is supported via a free joint stage between the plurality of support legs and the table. Further, the lower table is moved horizontally by a side thrust mechanism disposed on the outside of the vacuum chamber.