high performance and high quality micro devices, etc. are produced highly efficiently at a high throughput. Before transferring a wafer W to an exposure apparatus 200 for exposing the wafer W, marks formed on the wafer W is measured by an in-line measurement device 400 and a measurement result and/or a result of performing calculation processing on the measurement result is notified to the exposure apparatus 200. In the exposure apparatus 200, a measurement condition is optimized based on the notified result and an alignment processing and other processing are performed.