发明申请
- 专利标题： METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES
- 专利标题（中）： 制造半导体封装的方法
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申请号： US11553098申请日： 2006-10-26
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公开(公告)号： US20070054484A1公开(公告)日： 2007-03-08
- 发明人: Ying-Ren Lin , Ho-Yi Tsai , Chien-Ping Huang
- 申请人： Ying-Ren Lin , Ho-Yi Tsai , Chien-Ping Huang
- 申请人地址： TW Taichung
- 专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址： TW Taichung
- 优先权： TW093118242 20040624
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method for positioning a semiconductor component is disclosed. The method includes providing the semiconductor component and a carrier, the carrier having a plurality of openings, a protruded portion being provided at each corner position of each of the openings and extended toward a center of the opening, a distance between two diagonal protruded portions of the opening being slightly larger than that between two diagonal corners of the semiconductor component; and positioning the semiconductor component in the openings of the carrier via the protruded portions provided at each corner position of each of the openings.
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