发明申请
- 专利标题： Method of controlling contact load in electronic component mounting apparatus
- 专利标题（中）： 控制电子部件安装装置的接触负荷的方法
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申请号： US10596218申请日： 2005-08-31
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公开(公告)号： US20070056157A1公开(公告)日： 2007-03-15
- 发明人: Shuichi Hirata , Yasuharu Ueno , Makoto Morikawa , Hiroyuki Yoshida , Noriaki Yoshida
- 申请人： Shuichi Hirata , Yasuharu Ueno , Makoto Morikawa , Hiroyuki Yoshida , Noriaki Yoshida
- 申请人地址： JP Osaka 571-8501
- 专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址： JP Osaka 571-8501
- 优先权： JP2004/254532 20040901
- 国际申请： PCT/JP05/16376 WO 20050831
- 主分类号： B23K3/08
- IPC分类号： B23K3/08 ; H05K3/30
摘要：
A method of controlling contact load in an apparatus for mounting electronic components on a substrate includes moving a head holding an electronic component down by a predetermined distance. Contact load is measured after moving the head down. A determination is made as to whether the measured contact load has reached the target contact load. The moving and measuring are repeated until the measured contact load reaches the predetermined target contact load.
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