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    METHOD OF MANUFACTURING REACTOR
    2.
    发明申请
    METHOD OF MANUFACTURING REACTOR 审中-公开
    制造反应器的方法

    公开(公告)号：US20160189862A1

    公开(公告)日：2016-06-30

    申请号：US14976579

    申请日：2015-12-21

    申请人： Hiroyuki MIYAUCHI ,  Shuichi HIRATA ,  Takeshi OKADA ,  Satoshi ITO ,  Kengo HARA

    发明人： Hiroyuki MIYAUCHI ,  Shuichi HIRATA ,  Takeshi OKADA ,  Satoshi ITO ,  Kengo HARA

    IPC分类号： H01F41/00

    CPC分类号： H01F41/005 ,  H01F27/022 ,  H01F27/306 ,  H01F27/324 ,  H01F37/00

    摘要： Breakage of a ring core or a bobbin upon injection molding of molten resin is to be prevented in a method of manufacturing a reactor including the ring core. A reactor includes a ring core, a bobbin, a pair of coils, and a plastic cover. The bobbin includes a pair of cylinder portions, and flanges connecting ends of the cylinder portions. The reactor is manufactured by following processes. First protrusions that make contact with an inner circumferential surface of the ring core are provided on outer sides of the flanges along a cylinder axis direction. Second protrusions are provided at positions facing the corresponding first protrusions across the ring core are provided on a cavity surface of a mold that forms the plastic cover by injection molding. The plastic cover is formed by injecting molten resin into the mold while clamping the ring core by the first and second protrusions.

    摘要翻译： 在制造包括环形芯的反应器的方法中，可以防止熔融树脂注射成型时的环芯或线轴的破损。 反应器包括环形芯，线轴，一对线圈和塑料盖。 筒管包括一对圆筒部分和连接圆筒部分的端部的凸缘。 反应器通过以下方法制造。 沿着圆筒轴线方向在凸缘的外侧设置与环形芯的内周面接触的第一突起。 在通过注射成型形成塑料盖的模具的空腔表面上设置第二凸起，所述第二突起设置在穿过环形芯的相应的第一突起的位置。 塑料盖通过将熔融树脂注入模具而形成，同时通过第一和第二突起夹住环形芯。

    Component feeder
    4.
    发明授权
    Component feeder 有权
    组件馈线

    公开(公告)号：US07731469B2

    公开(公告)日：2010-06-08

    申请号：US10537406

    申请日：2003-11-28

    申请人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

    发明人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

    IPC分类号： B65H1/00

    CPC分类号： H01L21/67144 ,  H01L21/67132

    摘要： According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.

    摘要翻译： 根据放置在部件供给器的板放置装置中的板的类型，通过调节用于托盘进给的板加压构件的下降位置，根据板的类型选择性地和自动地执行适当的保持操作和膨胀操作 通过释放用于晶片馈送板的降低位置的调节，牢固地保持板并执行晶片扩张，同时牢固地保持晶片馈送板。

    COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE
    5.
    发明申请
    COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE 审中-公开
    组件供电头设备和组件安装头设备

    公开(公告)号：US20100064510A1

    公开(公告)日：2010-03-18

    申请号：US12626799

    申请日：2009-11-27

    申请人： Shoriki NARITA ,  Satoshi SHIDA ,  Yasuharu UENO ,  Makoto MORIKAWA ,  Hironori KOBAYASHI ,  Shuichi HIRATA

    发明人： Shoriki NARITA ,  Satoshi SHIDA ,  Yasuharu UENO ,  Makoto MORIKAWA ,  Hironori KOBAYASHI ,  Shuichi HIRATA

    IPC分类号： B23P19/00

    CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/6838 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/01087 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.

    摘要翻译： 反转头装置（22）的吸嘴（65）具有在其内开有吸孔（65b）的前端面（65a）和与吸引孔（65b）一端连通的吸入通路（65c） 其中。 吸入孔（65b）外侧的远端面（65a）的一部分与电子部件（12）的凸块（39）抵接。 抽吸孔（65b）与没有凸起（39）的安装侧表面（12a）的一部分相对。 真空泵（65）通过吸入孔（65b）产生从吸入孔（65b）和安装侧面（12a）之间的间隙流入吸入通路（65c）的空气流。 电子部件（12）由空气流产生的负压保持在前端面（65a）。

    Method and apparatus for mounting electronic component
    8.
    发明授权
    Method and apparatus for mounting electronic component 失效
    电子元件安装方法及装置

    公开(公告)号：US5854745A

    公开(公告)日：1998-12-29

    申请号：US413441

    申请日：1995-03-30

    申请人： Nobuhiko Muraoka ,  Shinji Kanayama ,  Shinzo Eguchi ,  Masaru Ichihara ,  Shuichi Hirata ,  Nobuhisa Watanabe

    发明人： Nobuhiko Muraoka ,  Shinji Kanayama ,  Shinzo Eguchi ,  Masaru Ichihara ,  Shuichi Hirata ,  Nobuhisa Watanabe

    IPC分类号： H01L21/00 ,  G06F19/00

    CPC分类号： H01L21/67144 ,  Y10T29/53087 ,  Y10T29/53191

    摘要： When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.

    摘要翻译： 当在电子部件供给部拾取电子部件，然后定位并安装在透明板上的预定安装位置时，形成在透明板上的安装位置的安装位置标记与形成在电子部件上的定位标记对准 ，从而从与要安装电子部件的透明面板的与表面相反的表面相对位置识别，从而基于在安装电子部件之前的识别结果来校正电子部件的位置 在透明面板上的预定安装位置。