发明申请
- 专利标题： Multiple zone sputtering target created through conductive and insulation bonding
- 专利标题（中）： 通过导电和绝缘结合产生多区域溅射靶
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申请号： US11399122申请日： 2006-04-06
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公开(公告)号： US20070056845A1公开(公告)日： 2007-03-15
- 发明人: Yan Ye , John White , Akihiro Hosokawa , Hien Le , Elpidio Nisperos , Bradley Stimson
- 申请人： Yan Ye , John White , Akihiro Hosokawa , Hien Le , Elpidio Nisperos , Bradley Stimson
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： C23C14/32
- IPC分类号： C23C14/32 ; C23C14/00
摘要：
The present invention generally provides a sputtering apparatus and method in which a sputtering target has a plurality of target sections bonded to a common backing plate. Each segment can be bonded to the common backing plate using a different bonding material. One target segment can be bonded to the backing plate using electrically conductive bonding material while another section is bonded to the backing plate using electrically insulating bonding material. Additionally, each different target section can be separately biased.
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