发明申请
- 专利标题： External contact material for external contacts of a semiconductor device and method of making the same
- 专利标题（中）： 用于半导体器件的外部触点的外部接触材料及其制造方法
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申请号： US11520035申请日： 2006-09-13
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公开(公告)号： US20070057372A1公开(公告)日： 2007-03-15
- 发明人: Michael Bauer , Irmgard Escher-Poeppel , Edward Fuergut , Simon Jerebic , Bernd Rakow , Peter Strobel , Holger Woerner
- 申请人： Michael Bauer , Irmgard Escher-Poeppel , Edward Fuergut , Simon Jerebic , Bernd Rakow , Peter Strobel , Holger Woerner
- 优先权： DE102005043808.3 20050913
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.
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