公开(公告)号：US07943423B2

公开(公告)日：2011-05-17

申请号：US12401111

申请日：2009-03-10

申请人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

发明人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.

摘要翻译： 制造半导体器件的方法包括将多个芯片放置在载体上。 将封装材料施加到多个芯片和用于形成封装工件的载体。 封装工件具有面向载体的第一主面和与第一主面相对的第二主面。 此外，标记元件相对于多个芯片施加到封装工件，标记元件可在第一主面和第二主面上检测。

公开(公告)号：US20100233831A1

公开(公告)日：2010-09-16

申请号：US12401111

申请日：2009-03-10

申请人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

发明人： Jens Pohl ,  Edward Fuergut ,  Markus Brunnbauer ,  Thorsten Meyer ,  Peter Strobel ,  Daniel Porwol ,  Ulrich Wachter

IPC分类号： H01L21/50 ,  H01L21/66

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.

摘要翻译： 制造半导体器件的方法包括将多个芯片放置在载体上。 将封装材料施加到多个芯片和用于形成封装工件的载体。 封装工件具有面向载体的第一主面和与第一主面相对的第二主面。 此外，标记元件相对于多个芯片施加到封装工件，标记元件可在第一主面和第二主面上检测。

公开(公告)号：US07592236B2

公开(公告)日：2009-09-22

申请号：US11582551

申请日：2006-10-18

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/6715 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form via a joining material jet appliance, to the back surfaces of the semiconductor chips of a divided semiconductor wafer.

摘要翻译： 在制造半导体器件中，将半导体芯片的背面施加接合材料的结构。 接合材料通过接合材料喷射器具以精细计量和结构化的形式施加到分开的半导体晶片的半导体芯片的背面。

公开(公告)号：US07547645B2

公开(公告)日：2009-06-16

申请号：US11504782

申请日：2006-08-16

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/20

CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.

摘要翻译： 涂覆包括至少一个半导体芯片的结构的方法包括在待涂覆结构的区域上静电沉积涂层颗粒。 首先将涂层颗粒施加到载体上，然后将涂层颗粒带电涂覆颗粒。 包括至少一个半导体芯片的结构被静电充电到与载体相反的极性。 然后将载体和/或结构沿待涂覆结构的区域的方向彼此移动，直到涂层颗粒跳到要涂覆的结构的区域并粘附在那里。 涂覆颗粒通过用涂覆颗粒加热该区域而液化以形成涂层。

公开(公告)号：US07327023B2

公开(公告)日：2008-02-05

申请号：US11246545

申请日：2005-10-11

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US07294916B2

公开(公告)日：2007-11-13

申请号：US11465547

申请日：2006-08-18

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L23/02

CPC分类号： H01L23/49562 ,  H01L21/3081 ,  H01L21/78 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.

摘要翻译： 公开了一种具有薄型半导体芯片的半导体器件及其制造方法。 在一个实施例中，变薄的半导体芯片具有具有接触区域的顶侧和具有后侧电极的后侧。 在这种情况下，后侧电极经由导电层与电路载体的芯片焊盘粘结地连接。 在另一个实施例中，根据本发明的该半导体器件的薄化半导体芯片具有具有半导体元件结构和通过蚀刻技术图案化的边缘侧的低微细边缘侧区域。

公开(公告)号：US20070057372A1

公开(公告)日：2007-03-15

申请号：US11520035

申请日：2006-09-13

申请人： Michael Bauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut ,  Simon Jerebic ,  Bernd Rakow ,  Peter Strobel ,  Holger Woerner

发明人： Michael Bauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut ,  Simon Jerebic ,  Bernd Rakow ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  B23K35/262 ,  C21D9/50 ,  H01L23/49866 ,  H01L23/49883 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/087 ,  H05K2203/1163 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.

摘要翻译： 描述了用于半导体器件的外部触点的外部接触材料及其制造方法。 外部接触材料包括无铅焊料。 在焊料材料中提供的是形成多个气孔的填​​料和/或具有布置在焊料材料的体积中的塑料颗粒。

公开(公告)号：US07772105B2

公开(公告)日：2010-08-10

申请号：US11925117

申请日：2007-10-26

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Peter Strobel ,  Hermann Vilsmeier ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

摘要翻译： 半导体部件包括塑料外壳，包括塑料外表面; 布置在壳体的下侧上的下外接触表面; 布置在壳体的与底侧相对的顶侧上的上外接触表面; 以及外部互连件，其将所述下部外部接触表面电连接到所述上部外部接触表面，所述外部互连件包括布置在沿着所述壳体的外部轮廓的导电路径上的焊料层。

公开(公告)号：US20100051190A1

公开(公告)日：2010-03-04

申请号：US11721067

申请日：2005-11-23

申请人： Simon Jerebic ,  Peter Strobel

发明人： Simon Jerebic ,  Peter Strobel

IPC分类号： H01L21/70 ,  C09J7/02

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2224/274 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/3512 ,  H01L2924/00

摘要： The invention relates to a method for applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this case, the adhesive layer, with the aid of an adhesive film which is entirely composed of precurable adhesive, is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is finally used further in the semiconductor device into which the thinned semiconductor chip is to be incorporated.

摘要翻译： 本发明涉及一种将粘合剂层应用于半导体晶片的接地薄或薄化半导体芯片的方法。 在这种情况下，粘合剂层借助于完全由预粘合剂组成的粘合剂薄膜通过半导体晶片的研磨，分离和分离相对较早地引入用于稀化的方法以形成变薄的半导体芯片，以及 最后在半导体器件中被进一步使用，半导体器件将被掺入到其中被加入稀薄的半导体芯片中。

公开(公告)号：US07662664B2

公开(公告)日：2010-02-16

申请号：US11780786

申请日：2007-07-20

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H05K1/141 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8388 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/3512

摘要： An electronic circuit in a package-on-package configuration includes: a lower subassembly with a first electronic element, a first wiring carrier, a first housing with a first redistribution layer and an arrangement of solder balls disposed on the first redistribution layer and an upper subassembly with a second electronic element mounted on the lower subassembly. A method for producing the electronic circuit in a package-on-package configuration includes: adhering an upper side of the first electronic element to an underside of the first redistribution layer via a radiation-crosslinking thermoplastic adhesive.

摘要翻译： 封装在封装构造中的电子电路包括：具有第一电子元件的下部子组件，第一布线载体，具有第一再分布层的第一壳体和布置在第一再分布层上的焊球布置，以及上部 子组件具有安装在下部子组件上的第二电子元件。 一种封装在封装结构中的电子电路的制造方法，其特征在于，包括：通过辐射交联热塑性粘合剂将第一电子元件的上侧粘接到第一再分布层的下侧。