Invention Application
US20070059638A1 Photosensitive resin composition 审中-公开
感光树脂组合物

  • Patent Title: Photosensitive resin composition
  • Patent Title (中): 感光树脂组合物
  • Application No.: US11519790
    Application Date: 2006-09-13
  • Publication No.: US20070059638A1
    Publication Date: 2007-03-15
  • Inventor: Osamu NambaSatoru Uchidoi
  • Applicant: Osamu NambaSatoru Uchidoi
  • Priority: JP2005-267205 20050914
  • Main IPC: G03C1/00
  • IPC: G03C1/00
Photosensitive resin composition
Abstract:
The present invention provides a photosensitive resin composition having improved stability in a bright room, which can provide a printing plate material having superior image remaining property and printing durability, which can be subjected to alkaline development. Accordingly, the present invention relates to a photosensitive resin composition comprising an ethylenically unsaturated compound, an alkali-soluble resin, a near-infrared-absorbing dye, a halomethyl group-containing compound, a nitroxyl compound and an organo boron anion-containing compound, and a printing plate material comprising a substrate and a photosensitive layer formed by applying the photosensitive resin composition on the substrate.
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