Photosensitive resin composition
    1.
    发明申请
    Photosensitive resin composition 审中-公开
    感光树脂组合物

    公开(公告)号:US20070059637A1

    公开(公告)日:2007-03-15

    申请号:US11519786

    申请日:2006-09-13

    Abstract: The present invention provides a photosensitive resin composition which can provide a printing plate material having superior image remaining property and printing durability, which can be subjected to alkaline development. The present invention relates to a photosensitive resin composition comprising an ethylenically unsaturated compound, an alkali-soluble resin, a near-infrared-absorbing dye, a halomethyl group-containing compound and an organo boron anion-containing compound, wherein said alkali-soluble resin has carboxyl groups as a side chain, at least one of which is reacted with an epoxy group-containing ethylenically unsaturated compound to introduce an ethylenically unsaturated group, said organo boron anion-containing compound is a compound represented by a certain chemical formula (a), and wherein weight ratio of said ethylenically unsaturated compound: said alkali-soluble resin is from 40:60 to 90:10.

    Abstract translation: 本发明提供一种能够提供具有优异的图像残留性和印刷耐久性的印刷版材料的感光性树脂组合物,其可以进行碱性显影。 本发明涉及包含烯属不饱和化合物,碱溶性树脂,近红外吸收染料,含卤代甲基化合物和含有机硼阴离子的化合物的感光性树脂组合物,其中所述碱溶性树脂 具有羧基作为侧链,其中至少一个与含环氧基的烯属不饱和化合物反应以引入烯属不饱和基团,所述含有有机硼阴离子的化合物是由某种化学式(a)表示的化合物, ,其中所述烯属不饱和化合物:所述碱溶性树脂的重量比为40:60至90:10。

    Aqueous photosolder resist composition
    2.
    发明授权
    Aqueous photosolder resist composition 失效
    水性光致抗蚀剂组合物

    公开(公告)号:US06361924B1

    公开(公告)日:2002-03-26

    申请号:US09633062

    申请日:2000-08-04

    CPC classification number: G03F7/032 G03F7/0388 H05K3/287

    Abstract: Disclosed are aqueous photosolder resist compositions containing (A) an aqueous solution prepared by neutralizing a resin containing a free-radically polymerizable group and a carboxyl group with a base; (B) an inorganic filler; (C) a photocurable mixture of (c-1) a multifunctional acrylic monomer, (c-2) a compound having a cyclic ether group other than a glycidyl group and (c-3) a photoinitiator; and optionally (D) an aqueous solution prepared by neutralizing a frege-radically polymerized substance having an acid value of 130-230 mgKOH/mg. The cyclic ether group other than a glycidyl group is an alicyclic epoxy or oxetane group, for example.

    Abstract translation: 公开了含有(A)通过将含有可自由基聚合基团和羧基的树脂与碱中和的制备的水溶液的水性光致抗蚀剂组合物, (B)无机填料; (C)(c-1)多官能丙烯酸类单体,(c-2)具有除了缩水甘油基以外的环状醚基的化合物和(c-3)光引发剂的光固化性混合物; 和(D)通过中和酸值为130-230mgKOH / mg的自由基聚合物质制备的水溶液。 除缩水甘油基以外的环状醚基是脂环式环氧基或氧杂环丁烷基。

    Heatcurable dielectric resin composition and heatcurable dielectric resin film
    3.
    发明申请
    Heatcurable dielectric resin composition and heatcurable dielectric resin film 审中-公开
    热固性介电树脂组合物和热固性介电树脂薄膜

    公开(公告)号:US20070299164A1

    公开(公告)日:2007-12-27

    申请号:US11344250

    申请日:2006-02-01

    CPC classification number: H01B3/12 H01B3/40 H01G4/206 H05K1/162 H05K2201/0209

    Abstract: The invention relates to a heatcurable dielectric resin composition for preparing a flexible heatcurable dielectric resin film having an uncured state, the resin film comprising an epoxy resin A having a solid state at normal temperature and an epoxy resin B having a viscosity of 10 Pa·s or less at 25° C. in a ratio (A:B) by weight of 25:75 to 75:25, and further comprising a dielectric ceramics in an amount of 20 to 80 volt based on the total amount of the epoxy resins A and B.

    Abstract translation: 本发明涉及一种用于制备具有未固化状态的柔性可热固化介电树脂膜的热固性介电树脂组合物,该树脂膜包含常温下具有固态的环氧树脂A和粘度为10Pa.s的环氧树脂B 或25℃以下,25:75〜75:25的比例(A:B),还包含相对于环氧树脂A的总量为20〜80伏特的电介质陶瓷 和B.

    Photosensitive resin composition
    4.
    发明申请
    Photosensitive resin composition 审中-公开
    感光树脂组合物

    公开(公告)号:US20070059638A1

    公开(公告)日:2007-03-15

    申请号:US11519790

    申请日:2006-09-13

    Abstract: The present invention provides a photosensitive resin composition having improved stability in a bright room, which can provide a printing plate material having superior image remaining property and printing durability, which can be subjected to alkaline development. Accordingly, the present invention relates to a photosensitive resin composition comprising an ethylenically unsaturated compound, an alkali-soluble resin, a near-infrared-absorbing dye, a halomethyl group-containing compound, a nitroxyl compound and an organo boron anion-containing compound, and a printing plate material comprising a substrate and a photosensitive layer formed by applying the photosensitive resin composition on the substrate.

    Abstract translation: 本发明提供了一种在明亮的房间中具有改善的稳定性的光敏树脂组合物,其可以提供具有优异的图像残留性和印刷耐久性的印版材料,其可以进行碱性显影。 因此,本发明涉及包含烯键式不饱和化合物,碱溶性树脂,近红外线吸收染料,含卤代甲基的化合物,硝酰基化合物和含有机硼阴离子的化合物的感光性树脂组合物, 以及印刷版材料,其包含基板和通过将感光性树脂组合物涂布在基板上而形成的感光层。

    Photosolder resist composition
    5.
    发明授权
    Photosolder resist composition 失效
    photoolder抗蚀剂组成

    公开(公告)号:US06767678B2

    公开(公告)日:2004-07-27

    申请号:US09988036

    申请日:2001-11-16

    CPC classification number: G03F7/0388 G03F7/033 H05K3/287

    Abstract: A photosolder resist composition of the invention is characterized by containing (A) a resin containing radical polymerization groups and carboxyl groups obtained by adding a cyclic ether group of a cyclic ether group-containing vinyl monomer to a carboxylic group of a radical copolymer containing at least isobornyl (meth) acrylate and a carboxyl group-containing vinyl monomer as monomer units; (B) an inorganic filler; and (C) a photocurable mixture of a polyfunctional acrylic monomer (c1), a cyclic ether group-containing compound (c2), and a photopolymerization initiator (c3).

    Abstract translation: 本发明的光致抗蚀剂组合物的特征在于含有(A)含有自由基聚合基团和羧基的树脂,其通过将含环状醚基的乙烯基单体的环状醚基团添加至至少含有自由基共聚物的羧基, (甲基)丙烯酸异冰片酯和含羧基的乙烯基单体作为单体单元; (B)无机填料; 和(C)多官能丙烯酸类单体(c1),含环状醚基的化合物(c2)和光聚合引发剂(c3)的光固化性混合物。

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