发明申请
US20070062414A1 Coating solutions for use in forming bismuth-based ferroelectric thin films and a method of forming bismuth-based ferroelectric thin films using the coating solutions 审中-公开
用于形成铋基铁电薄膜的涂布溶液和使用该涂布溶液形成铋基铁电薄膜的方法

  • 专利标题: Coating solutions for use in forming bismuth-based ferroelectric thin films and a method of forming bismuth-based ferroelectric thin films using the coating solutions
  • 专利标题(中): 用于形成铋基铁电薄膜的涂布溶液和使用该涂布溶液形成铋基铁电薄膜的方法
  • 申请号: US11603990
    申请日: 2006-11-24
  • 公开(公告)号: US20070062414A1
    公开(公告)日: 2007-03-22
  • 发明人: Yoshimi SatoAtsushi KawakamiYoshiyuki Takeuchi
  • 申请人: Yoshimi SatoAtsushi KawakamiYoshiyuki Takeuchi
  • 优先权: JP50889/2000 20000228
  • 主分类号: C04B28/36
  • IPC分类号: C04B28/36 B05D5/12 B05D3/02
Coating solutions for use in forming bismuth-based ferroelectric thin films and a method of forming bismuth-based ferroelectric thin films using the coating solutions
摘要:
Disclosed herein is a coating solution for use in forming Bi-based ferroelectric thin films comprises a specified compound, such as triglyme, dipivaloylmethane, pinacol, pivalic acid or hexyleneglycol, in combination with an organometallic compound containing metallic elements of which a Bi-based ferroelectric thin film to be formed is composed. Disclosed also herein is a method of forming Bi-based ferroelectric thin films using the coating solution.
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