发明申请
- 专利标题: Method and apparatus for measuring object thickness
- 专利标题(中): 测量物体厚度的方法和装置
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申请号: US11522416申请日: 2006-09-18
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公开(公告)号: US20070063698A1公开(公告)日: 2007-03-22
- 发明人: Lawrence Lei , Siqing Lu , Yu Chang , Cecilia Martner , Quyen Pham , Yu Gu , Joel Huston , Paul Smith , Gabriel Miller
- 申请人: Lawrence Lei , Siqing Lu , Yu Chang , Cecilia Martner , Quyen Pham , Yu Gu , Joel Huston , Paul Smith , Gabriel Miller
- 申请人地址: US CA Santa Ana
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Ana
- 主分类号: G01B7/06
- IPC分类号: G01B7/06
摘要:
A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.