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Invention Application
US20070069320A1 Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same 审中-公开
半导体封装的布线结构及其制造方法以及具有布线结构的晶片级封装及其制造方法

Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same
Abstract:
A wiring structure may include a pad, a conductive pattern and an insulating photoresist structure. The pad may be provided on a body and electrically connected to a circuit unit of the body. The conductive pattern may be provided on the body and may be electrically connected to the pad. The insulating photoresist structure may be provided on a surface of the conductive pattern. The insulating photoresist structure may have a contact hole through which the conductive pattern may be partially exposed. The insulating photoresist structure may be fabricated by providing a photosensitive photoresist film on the conductive layer, and patterning the photosensitive photoresist film by two photo processes.
Abstract(Chinese):

布线结构可以包括垫，导电图案和绝缘光致抗蚀剂结构。 垫可以设置在主体上并电连接到主体的电路单元。 导电图案可以设置在主体上并且可以电连接到垫。 绝缘光致抗蚀剂结构可以设置在导电图案的表面上。 绝缘光致抗蚀剂结构可以具有接触孔，导电图案可以通过该接触孔部分地暴露。 绝缘光致抗蚀剂结构可以通过在导电层上提供感光性光致抗蚀剂膜，并通过两个照相工艺对感光性光刻胶膜进行图案化来制造。

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