发明申请
- 专利标题： Pickup device and pickup method
- 专利标题（中）： 拾取装置和拾取方法
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申请号： US11524071申请日： 2006-09-20
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公开(公告)号： US20070069340A1公开(公告)日： 2007-03-29
- 发明人: Daiki Yamada , Naoto Kusumoto
- 申请人： Daiki Yamada , Naoto Kusumoto
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 优先权： JP2005-284550 20050929
- 主分类号： H01L29/40
- IPC分类号： H01L29/40
摘要：
It is an object of the present invention to provide a device which can pick up a chip from an adhesive film while preventing damage to the chip. In addition, a device which can pick up a chip over an adhesive film with a high yield is provided. A pickup device includes: a frame for holding a film to which a chip is attached, which is fixed to a support; a pressing jig which presses a surface of the film, to which a chip is not attached, while rotated or moved; a holding jig which holds the chip simultaneously with or after the pressing jig pressing the film; and a moving unit which moves the holding jig.
公开/授权文献
- US08137050B2 Pickup device and pickup method 公开/授权日：2012-03-20
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