发明申请
- 专利标题： Substrate holding apparatus, substrate holding method, and substrate processing apparatus
- 专利标题（中）： 基板保持装置，基板保持方法和基板处理装置
-
申请号： US10578100申请日： 2004-12-22
-
公开(公告)号： US20070070575A1公开(公告)日： 2007-03-29
- 发明人: Masahiko Sekimoto , Seiji Katsuoka , Naoki Dai , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Suzuki , Kenichi Kobayashi , Yasuyuki Motoshima , Ryo Kato
- 申请人： Masahiko Sekimoto , Seiji Katsuoka , Naoki Dai , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Suzuki , Kenichi Kobayashi , Yasuyuki Motoshima , Ryo Kato
- 优先权： JP2003-431346 20031225; JP2003-432480 20031226
- 国际申请： PCT/JP04/19681 WO 20041222
- 主分类号： H01T23/00
- IPC分类号： H01T23/00
摘要：
A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder (84) for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member (92); and a substrate pressing section (85) for lowering relative to the substrate holder (84) so as to press the substrate (W) held by the substrate holder (84) downward, thereby bringing the first sealing member (92) into pressure contact with the substrate (W); wherein the substrate pressing section (85) is provided with a second ring-shaped sealing member (170) which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder (84), thereby sealing the peripheral region of the substrate pressing section (85).
公开/授权文献
信息查询
