发明申请
US20070071994A1 Surface-treated a1 sheet having excellent solderability, heat sink using the sheet, and method for manufacturing the surface-treated a1 sheet having excellent solderability
审中-公开
具有优异的可焊性的表面处理的a1片材，使用该片材的散热片以及具有优异可焊性的表面处理的a1片材的制造方法
- 专利标题： Surface-treated a1 sheet having excellent solderability, heat sink using the sheet, and method for manufacturing the surface-treated a1 sheet having excellent solderability
- 专利标题（中）： 具有优异的可焊性的表面处理的a1片材，使用该片材的散热片以及具有优异可焊性的表面处理的a1片材的制造方法
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申请号： US10547087申请日： 2004-01-15
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公开(公告)号： US20070071994A1公开(公告)日： 2007-03-29
- 发明人: Takahiro Hayashida , Tomoyuki Tsuruda , Masao Komai
- 申请人： Takahiro Hayashida , Tomoyuki Tsuruda , Masao Komai
- 申请人地址： JP Tokyo 102-8447
- 专利权人： Toyo Kohan Co. Ltd.
- 当前专利权人： Toyo Kohan Co. Ltd.
- 当前专利权人地址： JP Tokyo 102-8447
- 优先权： JP2003-049689 20030226
- 国际申请： PCT/JP04/00222 WO 20040115
- 主分类号： B32B15/01
- IPC分类号： B32B15/01 ; B32B37/00 ; C25D7/06
摘要：
A surface-treated Al sheet that has excellent adhesion with a plating layer, solder wettability, and soldering strength, and can be preferably used for a heat sink which has excellent heat radiation and can be soldered; a heat sink using the Al sheet; and a method for manufacturing the surface-treated Al sheet at low cost are intended to be provided. A Zn layer is formed on a surface of an Al substrate, and a Ni layer and a Sn layer are formed by plating by displacement plating thereon, or a layer which has a solder flux property and improves thermal emission is further formed on the surface-treated Al sheet.
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