Invention Application
- Patent Title: Apparatus and method for composite behavioral modeling for multiple-sourced integrated circuits
- Patent Title (中): 用于多源集成电路的复合行为建模的装置和方法
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Application No.: US11239600Application Date: 2005-09-29
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Publication No.: US20070073529A1Publication Date: 2007-03-29
- Inventor: Gerald Bartley , Richard Ericson , Wesley Martin , Benjamin Mashak , Trevor Timpane , Ay Vang
- Applicant: Gerald Bartley , Richard Ericson , Wesley Martin , Benjamin Mashak , Trevor Timpane , Ay Vang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
An apparatus and method for simulation and testing of electronic systems using a single model that has the composite behavioral information of multiple parts. The single model allows the designer to simulate using one model that captures the anticipated extremes (best case behavior to worst case behavior) across a collection of devices from different vendors.
Public/Granted literature
- US07447619B2 Apparatus and method for composite behavioral modeling for multiple-sourced integrated circuits Public/Granted day:2008-11-04
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