Invention Application
- Patent Title: Attachment system
- Patent Title (中): 附件系统
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Application No.: US11243569Application Date: 2005-10-05
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Publication No.: US20070075402A1Publication Date: 2007-04-05
- Inventor: Frank Geefay , David Dutton , Qing Bai
- Applicant: Frank Geefay , David Dutton , Qing Bai
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.
Public/Granted literature
- US07554177B2 Attachment system incorporating a recess in a structure Public/Granted day:2009-06-30
Information query
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