- 专利标题: Optical interconnection module and method of manufacturing the same
-
申请号: US11285624申请日: 2005-11-22
-
公开(公告)号: US20070077008A1公开(公告)日: 2007-04-05
- 发明人: Keum Jeon , Min Lee , Sung Kang , Yong Kim , In Park
- 申请人: Keum Jeon , Min Lee , Sung Kang , Yong Kim , In Park
- 申请人地址: KR Seoul
- 专利权人: Doosan Corporation
- 当前专利权人: Doosan Corporation
- 当前专利权人地址: KR Seoul
- 优先权: KR10-2005-92541 20050930
- 主分类号: G02B6/42
- IPC分类号: G02B6/42 ; G02B6/26 ; G02B6/30 ; H01L21/00
摘要:
The present invention relates generally to an optical interconnection module for vertical optical coupling and a method of manufacturing the optical interconnection module. The optical interconnection module includes an optical waveguide. The optical waveguide includes substrate on which electrode pads and a predetermined circuit pattern are formed; a light source unit provided on the substrate and configured to generate an optical signal and emit the signal to an outside; an optical detection unit for receiving the optical signal from the light source unit and converting the optical signal into an electric signal; drive units provided on the substrate and configured to drive the light source unit and the light detection unit in response to electric signals supplied through the electrode pads; and a cladding layer, a core layer layered on the cladding layer, and an elliptical reflecting mirror surface placed on an end of the core layer facing the light source unit.