发明申请
US20070077413A1 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish
失效
低介电损耗切线树脂清漆，预浸料，层压板和使用清漆的印刷线路板
- 专利标题： Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish
- 专利标题（中）： 低介电损耗切线树脂清漆，预浸料，层压板和使用清漆的印刷线路板
-
申请号： US11529661申请日： 2006-09-29
-
公开(公告)号： US20070077413A1公开(公告)日： 2007-04-05
- 发明人: Satoru Amou , Haruo Akahoshi , Yoshihiro Nakamura , Nobuyuki Minami , Yasuhiro Murai
- 申请人： Satoru Amou , Haruo Akahoshi , Yoshihiro Nakamura , Nobuyuki Minami , Yasuhiro Murai
- 优先权： JP2005-291211 20051004
- 主分类号： B32B5/16
- IPC分类号： B32B5/16 ; C08K5/34
摘要：
There is provided a varnish of a low dielectric loss tangent resin composition which is low in viscosity and excellent in storage stability. The varnish of a low dielectric loss tangent resin composition contains a thermosetting monomer (A) having a weight average molecular weight of not more than 1,000, a high polymer (B) having a weight average molecular weight of not less than 5,000, a halogen flame-retardant agent (C), a silicon dioxide filler (D), and an organic solvent (E). The average particle diameter of each the components (C) and (D) is in the range of 0.2 to 3 μm.