公开(公告)号：US08479970B2

公开(公告)日：2013-07-09

申请号：US13523404

申请日：2012-06-14

申请人： Ryo Ishibashi ,  Katsuhito Takahashi ,  Seunghwan Park ,  Shinya Imano ,  Haruo Akahoshi ,  Kenya Ohashi

发明人： Ryo Ishibashi ,  Katsuhito Takahashi ,  Seunghwan Park ,  Shinya Imano ,  Haruo Akahoshi ,  Kenya Ohashi

IPC分类号： B23K20/12

CPC分类号： B23K20/1265 ,  B23K20/129 ,  B23K2101/12 ,  B23K2103/14 ,  Y10T428/12 ,  Y10T428/12389

摘要： Provided is high corrosion resistant equipment for a plant having the lining structure which exhibits high reliability against breaking of a joining portion over a long use period. The high corrosion resistant equipment for a plant includes a lining plate and a support portion which are made of a high corrosion resistance material and a structural material portion made of a steel material or the like. The lining plate and the support portion include a joining portion to which friction stirring is applied. The support portion is assembled into or fastened to the structural material portion by means of the geometrical structure with a gap interposed between the support portion and the structural material portion. Due to such a constitution, high corrosion resistant equipment for a plant having the lining which exhibits high reliability can be acquired.

摘要翻译： 本发明提供一种具有衬里结构的植物的高耐腐蚀性设备，其在长期使用期间表现出高的抗连接部分断裂的可靠性。 用于植物的高耐腐蚀设备包括由高耐腐蚀材料制成的衬板和支撑部分以及由钢材等制成的结构材料部分。 衬板和支撑部分包括施加摩擦搅拌的接合部分。 支撑部分通过几何结构组装到结构材料部分中或者紧固到结构材料部分，间隙插入在支撑部分和结构材料部分之间。 由于这样的结构，可以获得具有高可靠性的具有衬里的植物的高耐腐蚀性设备。

公开(公告)号：US20120205010A1

公开(公告)日：2012-08-16

申请号：US13369323

申请日：2012-02-09

申请人： Katsumi Mabuchi ,  Haruo Akahoshi

发明人： Katsumi Mabuchi ,  Haruo Akahoshi

IPC分类号： C23C22/73

CPC分类号： C23C22/50 ,  C08G77/18 ,  C09D4/00 ,  C09D5/08 ,  C09D183/04 ,  C23C18/122 ,  C23C18/1241 ,  C23C18/1245 ,  C23C18/1254 ,  C23C22/52 ,  C23C22/58 ,  C23C2222/20

摘要： The present invention provides a method of preventing a metal from corroding by giving a high corrosion resistance in the state of retaining the functions of the metal surface, a surface of a thin film material particularly. A stable silane coupling layer which has a robust bond is formed on a metal surface by using a silane coupling agent and an oxidizer in combination.

摘要翻译： 本发明提供一种通过在保持金属表面的功能，特别是薄膜材料的表面的状态下赋予高耐腐蚀性的方式来防止金属腐蚀的方法。 通过组合使用硅烷偶联剂和氧化剂，在金属表面上形成具有坚固结合的稳定的硅烷偶联层。

公开(公告)号：US20120067507A1

公开(公告)日：2012-03-22

申请号：US13307042

申请日：2011-11-30

申请人： Masahiko OGINO ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

发明人： Masahiko OGINO ,  Mitsuru Hasegawa ,  Kenya Ohashi ,  Akihiro Miyauchi ,  Hitoshi Suzuki ,  Toshio Haba ,  Haruo Akahoshi

IPC分类号： B29C33/42 ,  B29C65/00

CPC分类号： B29C33/3878 ,  B29C33/424 ,  C25D1/02 ,  C25D1/10 ,  Y10S425/81 ,  Y10T29/49549 ,  Y10T29/49552

摘要： The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

摘要翻译： 包括辊，具有内周面的缓冲管的精细图案模具与辊的外周面接触，并且压模管的内周面与缓冲管的外周面接触 并且在其外周面上形成微细的凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。

公开(公告)号：US07944026B2

公开(公告)日：2011-05-17

申请号：US11962142

申请日：2007-12-21

申请人： Kazutaka Koshiishi ,  Mitsuaki Katagiri ,  Satoshi Isa ,  Haruo Akahoshi

发明人： Kazutaka Koshiishi ,  Mitsuaki Katagiri ,  Satoshi Isa ,  Haruo Akahoshi

IPC分类号： H01L29/40

CPC分类号： H01L23/66 ,  H01L23/647 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/19051 ,  H01L2924/3011 ,  H01L2924/00

摘要： A semiconductor device is mounted on a package substrate which has a power supply line and a signal line formed of a normal or predetermined resistance material layer on a dielectric layer. A resistance material layer has a high resistance as compared with the normal resistance material layer and is additionally provided on the surface of the normal resistance material layer of the peripheral face of the signal line closest to the power supply line.

摘要翻译： 半导体器件安装在封装衬底上，该封装衬底具有电源线和由介电层上的正常或预定电阻材料层形成的信号线。 电阻材料层与普通电阻材料层相比具有高电阻，并且附加地设置在最靠近电源线的信号线的外围面的正常电阻材料层的表面上。

公开(公告)号：US20100181100A1

公开(公告)日：2010-07-22

申请号：US12690949

申请日：2010-01-21

申请人： Hiroshi NAKANO ,  Hitoshi SUZUKI ,  Toshio HABA ,  Haruo AKAHOSHI ,  Hiroshi YOSHIDA ,  Akira CHINDA

发明人： Hiroshi NAKANO ,  Hitoshi SUZUKI ,  Toshio HABA ,  Haruo AKAHOSHI ,  Hiroshi YOSHIDA ,  Akira CHINDA

IPC分类号： H05K1/09 ,  H05K1/00 ,  H05K1/11 ,  B05D5/12 ,  C25D5/02

CPC分类号： C25D3/38 ,  C25D5/02 ,  H05K1/111 ,  H05K3/045 ,  H05K3/107 ,  H05K3/465 ,  H05K2201/09472 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2203/0108 ,  H05K2203/0723

摘要： A copper wiring board having fine wiring, and a method for manufacturing the same are provided. The copper wiring board of the present invention is a wiring board comprising an insulating substrate, a plurality of wire trenches formed in the insulating substrate, and wires filled in the wire trenches, wherein when any two of the wires are selected, and cross sections are taken perpendicular to a direction of current flow in the wires, a wire width in one wire cross section is narrower than a wire width in the other wire cross section, and a wire thickness in the one wire cross section is thicker than a wire thickness in the other wire cross section.

摘要翻译： 提供具有精细布线的铜布线板及其制造方法。 本发明的铜线路板是包括绝缘基板，形成在绝缘基板中的多个线沟槽和填充在线槽中的导线的布线板，其中当选择任何两条导线时，横截面为 垂直于电线中的电流方向取向，一根线横截面中的线宽比另一条线截面中的线宽窄，并且一条线横截面中的线厚度比线材厚度厚 另一条线截面。

公开(公告)号：US20090200070A1

公开(公告)日：2009-08-13

申请号：US12366707

申请日：2009-02-06

申请人： Takahiko KATO ,  Takashi NAITO ,  Yuichi SAWAI ,  Haruo AKAHOSHI ,  Shinji YAMADA

发明人： Takahiko KATO ,  Takashi NAITO ,  Yuichi SAWAI ,  Haruo AKAHOSHI ,  Shinji YAMADA

IPC分类号： H05K1/09 ,  C23C14/34 ,  H01B1/22

CPC分类号： H05K1/092 ,  B22F1/0074 ,  C22C1/0425 ,  C23C14/185 ,  C23C14/3414 ,  H01B1/026 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629

摘要： An object of the present invention is to provide an electronic component, including a wiring that contacts a glass or a glass ceramics member, for which a Cu-based wiring material capable of suppressing generation of bubbles in the glass or the glass ceramics member and having excellent migration resistance is used. The present invention provides an electronic component including a wiring that contacts a glass or a glass ceramics member. In the electronic component, the wiring material is formed of a binary alloy made of two elements of Cu and Al, and contains not more than 50.0% by weight of Al and a balance of unavoidable impurities.

摘要翻译： 本发明的目的是提供一种电子部件，其包括与玻璃或玻璃陶瓷部件接触的布线，对于能够抑制玻璃或玻璃陶瓷部件中的气泡产生的Cu系布线材料，具有 使用优良的耐迁移性。 本发明提供一种电子部件，其包括与玻璃或玻璃陶瓷部件接触的布线。 在电子部件中，布线材料由Cu和Al的两种元素制成的二元合金形成，并且含有不超过50.0重量％的Al和余量的不可避免的杂质。

公开(公告)号：US20070287289A1

公开(公告)日：2007-12-13

申请号：US11760969

申请日：2007-06-11

申请人： Toshio Haba ,  Hitoshi Suzuki ,  Naohito Satou ,  Haruo Akahoshi ,  Hiroshi Yoshida ,  Akira Chinda

发明人： Toshio Haba ,  Hitoshi Suzuki ,  Naohito Satou ,  Haruo Akahoshi ,  Hiroshi Yoshida ,  Akira Chinda

IPC分类号： H01L21/44

CPC分类号： H01L21/2885 ,  C25D3/38 ,  C25D5/022 ,  C25D5/34 ,  H05K3/108 ,  H05K3/241 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0392

摘要： [Problem to be Solved] An object of the present invention is to provide a method of forming a conductive pattern having an excellent uniformity of film thickness within the surface of a substrate independently of the density of the pattern. [Solution] The production method of a conductive pattern in accordance with the present invention comprises the step of electroplating for forming a conductive pattern by electroplating on a metal seed layer formed on an insulated substrate using a plating bath containing an accelerator for reducing the deposition overpotential of a plated metal.

摘要翻译： [待解决的问题]本发明的目的在于提供一种形成与图案的密度无关地在基板的表面内具有优异的膜厚均匀性的导电图案的方法。 [解决方案]根据本发明的导电图案的制造方法包括通过使用包含用于降低沉积超电势的促进剂的电镀液通过电镀在形成在绝缘基板上的金属种子层上形成导电图案的电镀步骤 的镀金属。

公开(公告)号：US07226690B2

公开(公告)日：2007-06-05

申请号：US11076954

申请日：2005-03-11

申请人： Masatoshi Sugimasa ,  Takeyuki Itabashi ,  Haruo Akahoshi ,  Hiroshi Yoshida

发明人： Masatoshi Sugimasa ,  Takeyuki Itabashi ,  Haruo Akahoshi ,  Hiroshi Yoshida

IPC分类号： H01M4/86 ,  H01M4/96 ,  H01M8/10 ,  B01J21/18

CPC分类号： H01M4/923 ,  B01J21/18 ,  B01J23/40 ,  B01J31/1633 ,  B01J31/226 ,  B01J35/0013 ,  B01J35/006 ,  B01J37/343 ,  B01J2531/821 ,  B01J2531/828 ,  H01M4/925 ,  H01M8/04186 ,  H01M8/1004 ,  H01M8/1009 ,  Y02P70/56

摘要： To use a catalyst material, which has a functional group that covalently binds to a catalyst metal particle on the surface of a catalyst carrier, and a catalyst metal particle that covalently binds to the functional group, for a fuel cell.

摘要翻译： 为了使用具有与催化剂载体表面上的催化剂金属颗粒共价结合的官能团的催化剂材料和与燃料电池共价结合的催化剂金属颗粒。

公开(公告)号：US07220481B2

公开(公告)日：2007-05-22

申请号：US10062562

申请日：2002-02-05

申请人： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

发明人： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

IPC分类号： B32B27/20 ,  B32B33/00 ,  C08K3/08 ,  C08K5/00

CPC分类号： H05K1/162 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/66 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31 ,  H01L2924/00

摘要： A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.

摘要翻译： 通过将含有金属的无机填料的亚微米颗粒作为必要组分进行绝缘处理如化学处理获得的高介电复合材料，进一步进行表面处理以提高其与有机树脂的相容性，然后分散在 有机树脂的介电常数为15以上，在100MHz〜80GHz的频率范围内的介电损耗角正切为0.1以下，因此能够有效地用于多层布线基板和模块基板。

公开(公告)号：US20060163725A1

公开(公告)日：2006-07-27

申请号：US11205175

申请日：2005-08-17

申请人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki ,  Akira Chinda

发明人： Toshio Haba ,  Hiroshi Yoshida ,  Haruo Akahoshi ,  Hitoshi Suzuki ,  Akira Chinda

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K3/241 ,  H01L21/4846 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/108 ,  H05K3/382 ,  H05K3/388 ,  H01L2924/00

摘要： It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.

摘要翻译： 本发明的目的是提供一种具有受控形状的高密度布线而不用抗蚀剂膜掩蔽的布线板及其制造方法。 在本发明中，在绝缘基板上具有铜布线的布线基板的制造方法包括以下步骤：在绝缘基板上形成金属籽晶层，金属种子层的粗糙化部分在铜布线或 形成凸起，并且通过电镀在具有粗糙形状的金属种子层的部分上形成铜或铜的合金的电镀膜。 在镀浴中加入抑制电镀反应的物质，在绝缘性基材的表面与电镀膜的一侧之间形成90度以下的角度。