发明申请
US20070077865A1 Method for controlling polysilicon removal 审中-公开
控制多晶硅去除的方法

Method for controlling polysilicon removal
摘要:
The invention is directed to a method of chemically-mechanically polishing a substrate comprising polysilicon and a material selected from silicon oxide and silicon nitride with a chemical-mechanical polishing system comprising an abrasive, a polyethylene oxide/polypropylene oxide copolymer, water, and a polishing pad.
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