Invention Application
- Patent Title: Integrated low application temperature hot melt adhesive processing system
- Patent Title (中): 集成低应用温度热熔胶处理系统
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Application No.: US11244808Application Date: 2005-10-06
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Publication No.: US20070080157A1Publication Date: 2007-04-12
- Inventor: Justin Mehaffy , David Duckworth , John Rye
- Applicant: Justin Mehaffy , David Duckworth , John Rye
- Main IPC: B67D5/62
- IPC: B67D5/62
Abstract:
An autofeeding low application temperature hot melt application system comprising a hot melt tank, a compact integrated auto feed, and operates at temperatures of not more than 260° F.
Public/Granted literature
- US08225963B2 Integrated low application temperature hot melt adhesive processing system Public/Granted day:2012-07-24
Information query
