发明申请
- 专利标题： Power package and fabrication method thereof
- 专利标题（中）： 电源封装及其制造方法
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申请号： US11544046申请日： 2006-10-06
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公开(公告)号： US20070080354A1公开(公告)日： 2007-04-12
- 发明人: Ming-Yao Lin , Ming-Te Lin , Sheng-Pan Huang , Chia-Chang Kuo , Chiu-Ling Chen
- 申请人： Ming-Yao Lin , Ming-Te Lin , Sheng-Pan Huang , Chia-Chang Kuo , Chiu-Ling Chen
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 优先权： TW094135098 20051007
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
The present invention relates to a combined light emitting diode (LED) package structure and a fabricating method for fabricating the same. The combined LED package structure includes an LED chip, a conductive structure and an encapsulant. The encapsulant encapsulates the LED chip and a portion of the conductive structure. The conductive structure has a thick metal member and a thin metal member. The thick metal member is used for carrying the LED chip, provide heat absorbing and heat dissipating paths to the LED chip, the bottom and a portion of the lateral side thereof are exposed to the outside of the encapsulant to increase heat dissipating area. The thin metal member is electrically connected to the LED chip via at least two conductive leads which are extended to a region outside of the encapsulant to serve as outside electrodes of the LED package structure.
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