摘要:
An LED package interface inspection apparatus for an LED device comprises a current source, a voltage measuring unit, and a testing control unit. The testing control unit provides at least one control signal to command the current source to output at least one current for the LED device. The testing control unit also provides at least two signals to command the voltage measuring unit to measure a first forward voltage of the LED device at a first time and a second forward voltage of the LED device at a second time. The testing control unit calculates a voltage difference between the first forward voltage and the second forward voltage, and determines that the LED device is defective if the voltage difference is larger than a predetermined threshold value.
摘要:
An illumination apparatus including a light-emitting unit and a lens module is described. The light-emitting unit is used for generating a light and has a light exit axis. The lens module has a light exit surface with a plurality of curved surfaces. The lens module receives the light and outputs the light from the curved surfaces. Further, the curved surfaces have at least two curvatures, each for adjusting a illumination range of the light output from the corresponding curved surface.
摘要:
A self-aligned method for fabricating a ridge-waveguide semiconductor laser uses two photoresist layers in the process. The lower one is photoresist ODUR1013, and the upper one is photoresist AZ5214E. The lower photoresist layer, ODUR1013, can only be developed by light of wavelength less than 300 nm, and the upper photoresist layer, AZ5214E, can only be developed by light of wavelength greater than 300 nm. In the process of forming an opening on the top of the ridge structure, a G-line mask aligner is used to develop the upper photoresist AZ5214E and to expose the lower photoresist ODUR1013. Then, by performing a reactive ion etching (RIE) process, the lower photoresist ODUR1013 and the dielectric within the opening are removed. The remains of the upper photoresist layer, AZ5214E, are used to protect the sidewalls of the ridge structure in the RIE process.
摘要:
A light emitting apparatus at least includes a light emitting device, a connecting wire structure, and a space-occupation body. The light emitting device is disposed in the space-occupation body, electrically coupled with the connecting wire structure, and emits a first-frequency-range light under a suitable driving voltage. A light emitting surface of the light emitting device structure is covered by a first anti-reflection layer with respect to the first-frequency-range light. A packaging material is filled into the space-occupation body. The packaging material at least includes a luminescent material. The luminescent material is excited by the first-frequency-range light, so as to generate at least a second-frequency-range light. A reflector is disposed on the light emitting surface of the light emitting apparatus, such that the first-frequency-range light is totally or mostly reflected back to the space-occupation body omni-directionally, and the excited second-frequency-range light passes through the reflector.
摘要:
A high efficiency white light emitting diode, having a light emitting diode chip, a transparent substrate, a transparent Ohmic electrode, a reflection layer, a contact diode and covered with submount with a conductive trace. The transparent substrate having a rough surface is disposed on a first surface of the chip. The transparent Ohmic electrode is disposed on a second surface of the chip and coupled with the contact electrode. The submount with the conductive trace used to carry the chip has a high thermal conductivity. The conductive trace is electrically connected to the contact electrode on the chip by soldering material. The surface of the chip is covered with fluorescent paste to absorb a portion of the light generated by the light emitting diode and to emit a complementary light, so that the observer can observe a white light.
摘要:
An illuminating device is provided. The illuminating device includes a light source and a lampshade. The light source provides a first light beam and a second light beam. The lampshade includes a first curved surface and a second curved surface. The first light beam is refracted by the first curved surface. The second light beam is reflected by the second curved surface, and a curvature of the first curved surface differs from a curvature of the second curved surface.
摘要:
A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.
摘要:
A light emitting apparatus includes at least including a light emitting device structure, a connecting wire structure, and a space-occupation body. The light emitting device structure is disposed in the space-occupation body, electrically coupled with the connecting wire structure, and emits a first-frequency-range light under a suitable driving voltage. A light emitting surface of the light emitting device structure is covered by a first anti-reflection layer with respect to the first-frequency-range light. A packaging material is filled into the space-occupation body. The packaging material at least includes a luminescent material. The luminescent material is excited by the first-frequency-range light, so as to generate at least a second-frequency-range light. reflector is disposed on the light emitting surface of the light emitting apparatus, such that the first-frequency-range light is totally or mostly reflected back to the space-occupation body omni-directionally, and the excited second-frequency-range light passes through the reflector.
摘要:
A bar-like side-emitting light guide suitable for re-directing an incident light beam such that the light beam emerges from each side of the structure. The guide structure includes a light guiding bar having an upper surface and a lower surface and extending along a longitudinal direction. On a cross-sectional plane of the light guiding bar, there is a first line interval on the upper surface. A second line interval, a third line interval and a coupling part are located at the lower surface. The coupling part couples with the second line interval and the third line interval. The distance from the lower surface of the light guiding bar to a reference plane of the upper surface varies such that the thickness gradually decreases from the coupling part to the sides. In addition, a planar light source module can be constructed by arranging the foregoing light guiding bars in parallel.
摘要:
A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.