发明申请
- 专利标题： Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
- 专利标题（中）： 配线基板，使用布线基板的半导体装置及其制造方法
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申请号： US11542261申请日： 2006-10-04
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公开(公告)号： US20070080439A1公开(公告)日： 2007-04-12
- 发明人: Katsumi Kikuchi , Shintaro Yamamichi , Yoichiro Kurita , Koji Soejima
- 申请人： Katsumi Kikuchi , Shintaro Yamamichi , Yoichiro Kurita , Koji Soejima
- 专利权人： NEC CORPORATION,NEC ELECTRONICS CORPORATION
- 当前专利权人： NEC CORPORATION,NEC ELECTRONICS CORPORATION
- 优先权： JP2005-297811 20051012
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A wiring board comprising a first surface on which a first electrode is disposed and a second surface on which a second electrode is disposed; at least a single insulation layer and at least a single wiring layer; and one or a plurality of mounted semiconductor elements, wherein the second electrode disposed on the second surface is embedded in the insulation layer, the surface on the opposite side of the exposed surface on the second surface side of the second electrode is connected to the wiring layer, and all or part of the side surface of the second electrode does not make contact with the insulation layer.
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