Invention Application
US20070084847A1 Stage, substrate processing apparatus, plasma processing apparatus, control method for stage, control method for plasma processing apparatus, and storage media 有权
级,衬底处理装置,等离子体处理装置,级的控制方法,等离子体处理装置的控制方法和存储介质

  • Patent Title: Stage, substrate processing apparatus, plasma processing apparatus, control method for stage, control method for plasma processing apparatus, and storage media
  • Patent Title (中): 级,衬底处理装置,等离子体处理装置,级的控制方法,等离子体处理装置的控制方法和存储介质
  • Application No.: US11529390
    Application Date: 2006-09-29
  • Publication No.: US20070084847A1
    Publication Date: 2007-04-19
  • Inventor: Chishio KoshimizuTomohiro Suzuki
  • Applicant: Chishio KoshimizuTomohiro Suzuki
  • Applicant Address: JP Minato-ku 107-8481
  • Assignee: TOKYO ELECTRON LIMITED
  • Current Assignee: TOKYO ELECTRON LIMITED
  • Current Assignee Address: JP Minato-ku 107-8481
  • Priority: JP2005-288355 20050930; JP2006-249485 20060914
  • Main IPC: F27B5/14
  • IPC: F27B5/14 F27B5/18
Stage, substrate processing apparatus, plasma processing apparatus, control method for stage, control method for plasma processing apparatus, and storage media
Abstract:
A stage onto which is electrostatically attracted a substrate to be processed in a substrate processing apparatus, which enables the semiconductor device yield to be improved. A temperature measuring apparatus 200 measures a temperature of the substrate to be processed. A temperature control unit 400 carries out temperature adjustment on the substrate to be processed such as to become equal to a target temperature based on a preset parameter. A temperature control unit 400 controls the temperature of the substrate to be processed by controlling the temperature adjustment by the temperature control unit 400 based on a measured temperature measured by the temperature measuring apparatus 200.
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