Invention Application
US20070084847A1 Stage, substrate processing apparatus, plasma processing apparatus, control method for stage, control method for plasma processing apparatus, and storage media
有权
级,衬底处理装置,等离子体处理装置,级的控制方法,等离子体处理装置的控制方法和存储介质
- Patent Title: Stage, substrate processing apparatus, plasma processing apparatus, control method for stage, control method for plasma processing apparatus, and storage media
- Patent Title (中): 级,衬底处理装置,等离子体处理装置,级的控制方法,等离子体处理装置的控制方法和存储介质
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Application No.: US11529390Application Date: 2006-09-29
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Publication No.: US20070084847A1Publication Date: 2007-04-19
- Inventor: Chishio Koshimizu , Tomohiro Suzuki
- Applicant: Chishio Koshimizu , Tomohiro Suzuki
- Applicant Address: JP Minato-ku 107-8481
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Minato-ku 107-8481
- Priority: JP2005-288355 20050930; JP2006-249485 20060914
- Main IPC: F27B5/14
- IPC: F27B5/14 ; F27B5/18

Abstract:
A stage onto which is electrostatically attracted a substrate to be processed in a substrate processing apparatus, which enables the semiconductor device yield to be improved. A temperature measuring apparatus 200 measures a temperature of the substrate to be processed. A temperature control unit 400 carries out temperature adjustment on the substrate to be processed such as to become equal to a target temperature based on a preset parameter. A temperature control unit 400 controls the temperature of the substrate to be processed by controlling the temperature adjustment by the temperature control unit 400 based on a measured temperature measured by the temperature measuring apparatus 200.
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