Invention Application
- Patent Title: Integrated Microphone
- Patent Title (中): 集成麦克风
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Application No.: US11535804Application Date: 2006-09-27
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Publication No.: US20070087466A1Publication Date: 2007-04-19
- Inventor: Jason Weigold , John Martin , Timothy Brosnihan
- Applicant: Jason Weigold , John Martin , Timothy Brosnihan
- Applicant Address: US MA Norwood
- Assignee: ANALOG DEVICES, INC.
- Current Assignee: ANALOG DEVICES, INC.
- Current Assignee Address: US MA Norwood
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of forming a microphone having a variable capacitance first deposits high temperature deposition material on a die. The high temperature material ultimately forms structure that contributes to the variable capacitance. The method then forms circuitry on the die after depositing the deposition material. The circuitry is configured to detect the variable capacitance.
Public/Granted literature
- US07795695B2 Integrated microphone Public/Granted day:2010-09-14
Information query
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