发明申请
- 专利标题： Semiconductor package and method of manufacturing the same
- 专利标题（中）： 半导体封装及其制造方法
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申请号： US11221812申请日： 2005-09-09
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公开(公告)号： US20070087471A1公开(公告)日： 2007-04-19
- 发明人: Jun-Young Yang , Tae-Suk Kim , You-Ock Joo
- 申请人： Jun-Young Yang , Tae-Suk Kim , You-Ock Joo
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor package comprises a silicon substrate having an insulative surface; a patterned metal layer, formed on the insulative surface of the silicon substrate; an insulation layer formed on the patterned metal layer, and the patterned metal layer being partially exposed for functioning as at least a set of the device attaching pads and ball attaching pads; at least a device electrically connected to the set of the device attaching pads; a sealing compound for covering portions of the insulative surface of the silicon substrate and encapsulating the devices; and a plurality of solder balls attached to the set of ball attaching pads.
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