发明申请
US20070089290A1 Method of making a printed circuit board with low cross-talk noise
失效
制造具有低串扰噪声的印刷电路板的方法
- 专利标题: Method of making a printed circuit board with low cross-talk noise
- 专利标题(中): 制造具有低串扰噪声的印刷电路板的方法
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申请号: US11634287申请日: 2006-12-06
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公开(公告)号: US20070089290A1公开(公告)日: 2007-04-26
- 发明人: John Lauffer , Voya Markovich , James McNamara , David Thomas
- 申请人: John Lauffer , Voya Markovich , James McNamara , David Thomas
- 申请人地址: US NY Endicott
- 专利权人: Endicott Interconnect Technologies, Inc.
- 当前专利权人: Endicott Interconnect Technologies, Inc.
- 当前专利权人地址: US NY Endicott
- 主分类号: H05K3/36
- IPC分类号: H05K3/36 ; H05K3/20
摘要:
A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.