发明申请
- 专利标题： Multi-chip package structure
- 专利标题（中）： 多芯片封装结构
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申请号： US11332293申请日： 2006-01-17
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公开(公告)号： US20070090507A1公开(公告)日： 2007-04-26
- 发明人: Chian-Chi Lin , Cheng-Yin Lee
- 申请人： Chian-Chi Lin , Cheng-Yin Lee
- 优先权： TW094137530 20051026
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A multi-chip package structure includes a first substrate, a first chip, a sub-package, and a first molding compound. The first substrate has a first surface and a second surface. The first chip is attached to the first surface of the first substrate by flip-chip bonding so as to reduce a step of wire bonding and reduce the total height of the package structure. The sub-package includes a second substrate, a second chip, and a second molding compound. The second substrate has a first surface and a second surface. The second substrate is a flexible substrate and is directly connected to the first surface of the first substrate so as to reduce another step of wire bonding.
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