发明申请
- 专利标题： Multi-chip package structure
- 专利标题（中）： 多芯片封装结构
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申请号： US11520769申请日： 2006-09-14
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公开(公告)号： US20070090508A1公开(公告)日： 2007-04-26
- 发明人: Chian-Chi Lin , Cheng-Yin Lee
- 申请人： Chian-Chi Lin , Cheng-Yin Lee
- 优先权： TW094137529 20051026; TW095115343 20060428
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
The present invention relates to a multi-chip package structure, which comprises a first substrate, a first chip, a sub-package structure, a plurality of first solder balls, and a first molding compound. The first substrate has a first surface and a second surface. The first chip is electrically connected to the first surface of the first substrate. The sub-package structure comprises a second substrate, a second chip, and a second molding compound. The first solder balls are disposed between the first substrate and the second substrate and are used for connecting the first surface of the first substrate and the second surface of the second substrate so as to omit a step of wire bonding.
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