发明申请
- 专利标题： TOOLS AND METHODS FOR DISUNITING SEMICONDUCTOR WAFERS
- 专利标题（中）： 用于散射半导体波长的工具和方法
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申请号： US11567417申请日： 2006-12-06
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公开(公告)号： US20070093039A1公开(公告)日： 2007-04-26
- 发明人: Sebastien Kerdiles , Yves-Matthieu Le Vaillant
- 申请人： Sebastien Kerdiles , Yves-Matthieu Le Vaillant
- 申请人地址： FR Bernin
- 专利权人： S.O.I.Tec Silicon on Insulator Technologies S.A.
- 当前专利权人： S.O.I.Tec Silicon on Insulator Technologies S.A.
- 当前专利权人地址： FR Bernin
- 优先权： FR0215902 20021216
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/30 ; H01L21/46
摘要：
A tool and method for disuniting two wafers, wherein at least one of the wafers is used in fabricating substrates for microelectronics, optoelectronics, or optics. The method includes the steps of temporarily affixing two gripper members to respective opposite faces of the wafers; and sufficiently displacing one of the gripper members relative to the other for inducing controlled flexing in at least one of the members and for exerting a force close to one edge of the wafers to assist in disuniting the wafers. If desired, the bonding energy between two wafers can be determined by measuring the force exerted during the displacement step or measuring the separation of the wafers while performing the disuniting operation.
公开/授权文献
- US07740735B2 Tools and methods for disuniting semiconductor wafers 公开/授权日：2010-06-22