发明申请
US20070094871A1 Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained thereby
审中-公开
制造具有嵌入其中的薄膜电容器的印刷电路板的方法和由此获得的印刷电路板
- 专利标题： Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained thereby
- 专利标题（中）： 制造具有嵌入其中的薄膜电容器的印刷电路板的方法和由此获得的印刷电路板
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申请号： US11592169申请日： 2006-11-03
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公开(公告)号： US20070094871A1公开(公告)日： 2007-05-03
- 发明人: Jin Moon , Yul Chung , Seung Sohn
- 申请人： Jin Moon , Yul Chung , Seung Sohn
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2005-0104674 20051103
- 主分类号： H01G7/00
- IPC分类号： H01G7/00
摘要：
The invention provides a method for manufacturing a printed circuit board with a film capacitor embedded therein and a printed circuit board obtained thereby. In the method, a lower electrode is formed on an insulating substrate. An amorphous dielectric film is formed on the lower electrode by low temperature film formation. Also, a metal seed layer is formed on the dielectric film by electroless plating. An upper electrode is formed on the metal seed layer by electrolytic plating.
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